Essemtec, in collaboration with We Network, invites electronics manufacturing professionals to an exclusive technical day dedicated to the latest innovations in SMT production, dispensing, repair & rework, and hybrid packaging.
📅September 10, 2026
📍We Network – Technocampus Électronique & IoT
Verrières-en-Anjou, France
The event will combine technical presentations and live machine demonstrations, offering practical insights into solutions addressing today’s electronics manufacturing challenges.
Key topics include:
1️⃣High-Mix Production Solutions
• Solder paste jetting
• Flexible and versatile production concepts
• All-in-One manufacturing solutions
2️⃣Repair & Rework
• Solder paste jetting and placement
• Reballing solutions
3️⃣Hybrid Packaging
• Advanced packaging technologies
• Process integration for miniaturized electronic assemblies
4️⃣Advanced Dispensing Solutions
• Underfill, glue dispensing, dam & fill
• Silver epoxy jetting
• Micro-dispensing and other high-precision applications
Throughout the day, attendees will discover how Essemtec’s technologies help improve flexibility, quality, and efficiency in modern electronics manufacturing.
📍Registration will open soon.
For more information:essemtec.info@nano-di.com